Technical parameters/frequency: | 24 MHz |
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Technical parameters/power supply voltage (DC): | 5.00 V, 5.25 V (max) |
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Technical parameters/number of pins: | 28 |
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Technical parameters/clock frequency: | 20 MHz |
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Technical parameters/RAM size: | 256 B |
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Technical parameters/digits: | 8 |
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Technical parameters/I/O pin count: | 22 |
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Technical parameters/access time: | 20.0 µs |
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Technical parameters/kernel architecture: | PIC |
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Technical parameters/memory capacity: | 8000 B |
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Technical parameters/internal nuclear architecture: | PIC16 |
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Technical parameters/Analog to Digital Conversion (ADC): | 1 |
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Technical parameters/number of inputs/outputs: | 22 Input |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 1000 mW |
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Technical parameters/power supply voltage: | 4.35V ~ 5.25V |
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Technical parameters/power supply voltage (Max): | 5.25 V |
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Technical parameters/power supply voltage (Min): | 4.35 V |
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Encapsulation parameters/installation method: | Through Hole |
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Package parameters/number of pins: | 28 |
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Encapsulation parameters/Encapsulation: | DIP-28 |
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Dimensions/Length: | 34.67 mm |
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Dimensions/Width: | 7.24 mm |
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Dimensions/Height: | 3.3 mm |
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Dimensions/Packaging: | DIP-28 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tube |
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Other/Manufacturing Applications: |
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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