Technical parameters/frequency: | 20 MHz |
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Technical parameters/power supply voltage (DC): | 5.00 V, 6.00 V (max) |
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Technical parameters/clock frequency: | 20.0 MHz |
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Technical parameters/RAM size: | 128 B |
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Technical parameters/I/O pin count: | 22 |
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Technical parameters/access time: | 20.0 µs |
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Technical parameters/kernel architecture: | PIC |
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Technical parameters/operating temperature (Max): | 70 ℃ |
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Technical parameters/operating temperature (Min): | 0 ℃ |
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Technical parameters/dissipated power (Max): | 1000 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 28 |
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Encapsulation parameters/Encapsulation: | SOIC |
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Dimensions/Packaging: | SOIC |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Rail, Tube |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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