Technical parameters/frequency: | 4 MHz |
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Technical parameters/power supply voltage (DC): | 5.00 V, 5.50 V (max) |
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Technical parameters/number of pins: | 18 |
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Technical parameters/clock frequency: | 4.00 MHz |
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Technical parameters/RAM size: | 80 B |
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Technical parameters/digits: | 8 |
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Technical parameters/dissipated power: | 1000 mW |
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Technical parameters/FLASH memory capacity: | 896 b |
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Technical parameters/I/O pin count: | 13 |
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Technical parameters/access time: | 4.00 µs |
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Technical parameters/kernel architecture: | PIC |
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Technical parameters/memory capacity: | 1000 B |
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Technical parameters/internal nuclear architecture: | PIC16 |
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Technical parameters/number of inputs/outputs: | 13 Input |
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Technical parameters/operating temperature (Max): | 70 ℃ |
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Technical parameters/operating temperature (Min): | 0 ℃ |
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Technical parameters/dissipated power (Max): | 1000 mW |
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Technical parameters/power supply voltage: | 2.5V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 2.5 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 18 |
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Encapsulation parameters/Encapsulation: | SOIC-18 |
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Dimensions/Length: | 11.53 mm |
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Dimensions/Width: | 7.49 mm |
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Dimensions/Height: | 2.31 mm |
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Dimensions/Packaging: | SOIC-18 |
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Physical parameters/operating temperature: | 0℃ ~ 70℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | <
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