Technical parameters/line gauge: | 4.00 AWG |
|
Technical parameters/Contact electroplating: | Tin |
|
Encapsulation parameters/installation method: | Lug |
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Physical parameters/contact material: | Copper |
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Physical parameters/materials: | Copper |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC000755
|
Multicomp | 功能相似 |
MULTICOMP MC000755 接线端子, 压片式, 9.53MM, 压接
|
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