Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | TSSOP-16 |
|
Dimensions/Packaging: | TSSOP-16 |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT23S08-1HPGG
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
IC CLK MULT PLL HI DRV 16-TSSOP
|
||
IDT23S08-5HPGG8
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
IC CLK MULT PLL HI DRV 16-TSSOP
|
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