Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 16 |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2308-1HPGGI
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
3.3V零延迟时钟乘法器 3.3V ZERO DELAY CLOCK MULTIPLIER
|
||
2308-1HPGGI8
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
3.3V零延迟时钟乘法器 3.3V ZERO DELAY CLOCK MULTIPLIER
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review