Technical parameters/minimum current amplification factor (hFE): | 200 |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -65 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 3 |
|
Encapsulation parameters/Encapsulation: | TO-236 |
|
Dimensions/Length: | 3 mm |
|
Dimensions/Width: | 1.4 mm |
|
Dimensions/Height: | 1 mm |
|
Dimensions/Packaging: | TO-236 |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MMUN2216LT1G
|
ON Semiconductor | 功能相似 | SOT-23-3 |
ON SEMICONDUCTOR MMUN2216LT1G 晶体管 双极预偏置/数字, BRT, 50 V, 100 mA, 4.7 kohm, SOT-23
|
||
PDTC143TT,215
|
Nexperia | 功能相似 | SOT-23-3 |
NXP PDTC143TT,215 晶体管 双极预偏置/数字, BRT, 50 V, 100 mA, 4.7 kohm, SOT-23
|
||
PDTC143TT,215
|
NXP | 功能相似 | SOT-23-3 |
NXP PDTC143TT,215 晶体管 双极预偏置/数字, BRT, 50 V, 100 mA, 4.7 kohm, SOT-23
|
||
PDTC143TT,235
|
Nexperia | 功能相似 | SOT-23-3 |
TO-236AB NPN 50V 100mA
|
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