Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 20 |
|
Encapsulation parameters/Encapsulation: | TSSOP-360 |
|
Dimensions/Packaging: | TSSOP-360 |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tube |
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Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Philips | 功能相似 | SO |
四路6位复用I2C EEPROM的DIP开关 Quad 6-bit multiplexed I2C EEPROM DIP switch
|
||
|
|
NXP | 功能相似 | SOT-163 |
四路6位复用I2C EEPROM的DIP开关 Quad 6-bit multiplexed I2C EEPROM DIP switch
|
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