Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 16 |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 功能相似 | SOIC |
4位复用/ 1位锁存5位I2C EEPROM 4-bit multiplexed/1-bit latched 5-bit I2C EEPROM
|
||
|
|
NXP | 功能相似 | SOIC |
4位复用/ 1位锁存5位I2C EEPROM 4-bit multiplexed/1-bit latched 5-bit I2C EEPROM
|
||
PCA8550DB,118
|
NXP | 功能相似 | SSOP-16 |
Pca8550 - 4位多路复用/1位闭锁的5位I2c Eeprom Dip开关
|
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