Technical parameters/rise/fall time: | 200 ns |
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Technical parameters/Input voltage (DC): | 1.20 V |
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Technical parameters/output current: | 100 mA |
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Technical parameters/number of circuits: | 1 |
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Technical parameters/number of channels: | 1 |
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Technical parameters/forward voltage: | 1.2 V |
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Technical parameters/dissipated power: | 550 mW |
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Technical parameters/rise time: | 200 ns |
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Technical parameters/isolation voltage: | 4000 Vrms |
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Technical parameters/forward current: | 25 mA |
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Technical parameters/forward voltage (Max): | 1.4 V |
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Technical parameters/forward current (Max): | 25 mA |
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Technical parameters/descent time: | 0.2 µs |
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Technical parameters/descent time (Max): | 500 ns |
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Technical parameters/rise time (Max): | 500 ns |
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Technical parameters/operating temperature (Max): | 80 ℃ |
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Technical parameters/operating temperature (Min): | -25 ℃ |
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Technical parameters/dissipated power (Max): | 550 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 14 |
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Encapsulation parameters/Encapsulation: | SOIC-14 |
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Dimensions/Length: | 9.22 mm |
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Dimensions/Width: | 6.5 mm |
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Dimensions/Height: | 3.5 mm |
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Dimensions/Packaging: | SOIC-14 |
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Physical parameters/operating temperature: | -25℃ ~ 80℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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