Technical parameters/rise/fall time: | 20ns, 10ns |
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Technical parameters/Input voltage (DC): | 1.60 V |
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Technical parameters/number of circuits: | 1 |
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Technical parameters/number of channels: | 1 |
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Technical parameters/forward voltage: | 1.5 V |
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Technical parameters/dissipated power: | 85 mW |
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Technical parameters/data rate: | 10.0 Mbps |
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Technical parameters/rise time: | 20 ns |
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Technical parameters/isolation voltage: | 3750 Vrms |
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Technical parameters/forward current: | 20 mA |
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Technical parameters/breakdown voltage: | 5 V |
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Technical parameters/forward voltage (Max): | 1.75 V |
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Technical parameters/forward current (Max): | 20 mA |
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Technical parameters/descent time: | 0.01 µs |
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Technical parameters/descent time (Max): | 10 ns |
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Technical parameters/rise time (Max): | 20 ns |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | 40 ℃ |
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Technical parameters/dissipated power (Max): | 85 mW |
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Technical parameters/power supply voltage: | 4.5V ~ 5.5V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 5.08 mm |
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Dimensions/Width: | 3.94 mm |
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Dimensions/Height: | 2.97 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Discontinued at Digi-Key |
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Other/Packaging Methods: | Tape & Ree Alternative material
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