Technical parameters/rise/fall time: | 4µs, 3µs |
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Technical parameters/Input voltage (DC): | 1.20 V |
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Technical parameters/output voltage: | ≤80.0 V |
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Technical parameters/number of circuits: | 1 |
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Technical parameters/number of channels: | 1 |
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Technical parameters/forward voltage: | 1.2 V |
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Technical parameters/dissipated power: | 170 mW |
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Technical parameters/rise time: | 18000 ns |
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Technical parameters/isolation voltage: | 2500 Vrms |
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Technical parameters/breakdown voltage (collector emitter): | 80 V |
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Technical parameters/forward current: | 10 mA |
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Technical parameters/output voltage (Max): | 80 V |
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Technical parameters/input current (Min): | 10 mA |
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Technical parameters/breakdown voltage: | 6 V |
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Technical parameters/forward voltage (Max): | 1.4 V |
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Technical parameters/forward current (Max): | 10 mA |
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Technical parameters/descent time: | 18000 ns |
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Technical parameters/operating temperature (Max): | 100 ℃ |
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Technical parameters/operating temperature (Min): | -30 ℃ |
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Technical parameters/dissipated power (Max): | 170 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 4 |
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Encapsulation parameters/Encapsulation: | 4-Mini-Flat |
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Dimensions/Length: | 2.6 mm |
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Dimensions/Width: | 4.4 mm |
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Dimensions/Height: | 2 mm |
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Dimensions/Packaging: | 4-Mini-Flat |
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Physical parameters/operating temperature: | -30℃ ~ 100℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Cut Alternative material
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