Technical parameters/minimum current amplification factor (hFE): | 30 |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
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Technical parameters/operating temperature (Min): | -65 ℃ |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 6 |
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Encapsulation parameters/Encapsulation: | UMT |
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Dimensions/Length: | 2.2 mm |
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Dimensions/Width: | 1.35 mm |
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Dimensions/Height: | 1 mm |
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Dimensions/Packaging: | UMT |
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Other/Product Lifecycle: | Active |
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Compliant with standards/RoHS standards: |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PBLS4003Y,115
|
NXP | 功能相似 | TSSOP-6 |
Nexperia PBLS4003Y,115 双 NPN + PNP 数字晶体管, 100 mA, 500 mA, Vce=40 V、50 V, 10 kΩ, 电阻比:1, 6引脚
|
||
PBLS4003Y,115
|
Nexperia | 功能相似 | SC-70-6 |
Nexperia PBLS4003Y,115 双 NPN + PNP 数字晶体管, 100 mA, 500 mA, Vce=40 V、50 V, 10 kΩ, 电阻比:1, 6引脚
|
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