Technical parameters/number of contacts: | 9 |
|
Technical parameters/polarity: | Male |
|
Technical parameters/rated current: | 5 A |
|
Technical parameters/capacitance: | 470 pF |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Encapsulation parameters/installation method: | Through Hole |
|
Dimensions/Length: | 30.81 mm |
|
Dimensions/Width: | 18.39 mm |
|
Dimensions/Height: | 12.55 mm |
|
Physical parameters/color: | Black |
|
Physical parameters/contact material: | Phosphor Bronze |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
182-009-113R531
|
NorComp | 类似代替 | Through Hole |
NORCOMP 182-009-113R531 连接器, D sub, 堆叠式, 直角, 182系列, DE, 插头, 9 触点, 钢主体, 通孔安装
|
||
|
|
Amphenol ICC | 完全替代 |
Conn D-Subminiature PIN 9POS 2.74mm Solder RA Thru-Hole 9 Terminal 1Port
|
|||
D09P33E4GV00LF
|
Amphenol | 完全替代 | throughHole |
Conn D-Subminiature PIN 9POS 2.74mm Solder RA Thru-Hole 9 Terminal 1Port
|
||
D09P33E4GX00LF
|
FCI Electronics | 完全替代 |
Conn D-Subminiature PIN 9POS 2.74mm Solder RA Thru-Hole 9 Terminal 1Port
|
|||
D09P33E4GX00LF
|
Amphenol ICC | 完全替代 |
Conn D-Subminiature PIN 9POS 2.74mm Solder RA Thru-Hole 9 Terminal 1Port
|
|||
D09P33E4GX00LF
|
Future Communications IC | 完全替代 |
Conn D-Subminiature PIN 9POS 2.74mm Solder RA Thru-Hole 9 Terminal 1Port
|
|||
D09P33E4GX00LF
|
AFCI | 完全替代 |
Conn D-Subminiature PIN 9POS 2.74mm Solder RA Thru-Hole 9 Terminal 1Port
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review