Technical parameters/power supply voltage (DC): | 2.00V (min) |
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Technical parameters/power supply current: | 900 µA |
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Technical parameters/number of channels: | 2 |
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Technical parameters/dissipated power: | 300 mW |
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Technical parameters/Input capacitance: | 7 pF |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 300 mW |
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Technical parameters/power supply voltage: | 2V ~ 15V |
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Technical parameters/power supply voltage (Max): | 15 V |
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Technical parameters/power supply voltage (Min): | 2 V |
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Encapsulation parameters/installation method: | Through Hole |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | DIP-8 |
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Dimensions/Packaging: | DIP-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Obsolete |
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Other/Packaging Methods: | Tube |
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Other/Manufacturing Applications: | I²C |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
NXP | 功能相似 | DIP |
DUAL BI-DIRECTIONAL BUS BUFFER
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