Technical parameters/RAM size: | 128 x 8 |
|
Technical parameters/Analog to Digital Conversion (ADC): | 1 |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 1500 mW |
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Encapsulation parameters/installation method: | Through Hole |
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Package parameters/number of pins: | 14 |
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Encapsulation parameters/Encapsulation: | DIP-14 |
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Dimensions/Packaging: | DIP-14 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Obsolete |
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Other/Packaging Methods: | Tube |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
P89LPC9107FDH,129
|
NXP | 功能相似 | TSSOP-14 |
MCU 8Bit 89LP 80C51 CISC 1KB Flash 2.5V/3.3V 14Pin TSSOP
|
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