Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 3893 |
|
Encapsulation parameters/Encapsulation: | SOT-23 |
|
Dimensions/Packaging: | SOT-23 |
|
Other/Product Lifecycle: | 0.2 µs |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HSMP-3893
|
HP | 功能相似 | SOT-23 |
Pin Diode, 35V V(BR)
|
||
HSMP-3893
|
AVAGO Technologies | 功能相似 | SOT-23 |
Pin Diode, 35V V(BR)
|
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