Encapsulation parameters/installation method: | Solder Lug, Panel |
|
Other/Packaging: | Tray |
|
Other/Background: | 500 mW (1/2 W) |
|
Other/Delete: | Potentiometer |
|
Other/저항: | 10 kOhms |
|
Other/종단 동: | Solder Lug |
|
Other/공차: | 20 % |
|
Other/Compare 입: | Rotary Metal |
|
Other/Brand: | BI Technologies / TT Electronics |
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Other/동착동동: | Panel Mount |
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Other/Element Comments 입: | Conductive Plastic |
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Other/Delete 동업체: | TT Electronics |
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Other/Number of Gangs: | 1 Gang |
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Other/う수: | 1 Turn |
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Other/Shaft Diameter: | 6.35 mm |
|
Other/Shaft's: | 25 mm |
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Other/Shaft comments 입: | Flatted |
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Other/Standard Pack Qty: | 200 |
|
Other/Apex: | Linear |
|
Other/RoHS: | Non-Compliant |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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