Dimensions/Diameter: | 5.10 mm |
|
Other/Type: | wire bonding |
|
Other/melting point: | 361°F（183°C） |
|
Other/Process: | leaded |
|
Other/Ingredients: | Sn63Pb37（63/37） |
|
Other/Flux Types: | No cleaning required |
|
Other/Diameter: | 0.020"（0.50mm） |
|
Other/Line Gauge: | 24 AWG，26 SWG |
|
Other/Core Dimensions: | 0.022 |
|
Other/Forms: | - |
|
Other/Shelf life: | No shelf life |
|
Other/Shipping Information: | - |
|
Other/Weight: | - |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review