Technical parameters/frequency: | 203 MHz |
|
Technical parameters/RAM size: | 43008 b |
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Technical parameters/dissipated power: | 2400 mW |
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Technical parameters/number of logic gates: | 80000 |
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Technical parameters/operating temperature (Max): | 70 ℃ |
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Technical parameters/operating temperature (Min): | 0 ℃ |
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Technical parameters/dissipated power (Max): | 2400 mW |
|
Technical parameters/power supply voltage: | 3V ~ 3.6V |
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Technical parameters/power supply voltage (Max): | 3.6 V |
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Technical parameters/power supply voltage (Min): | 3 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 256 |
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Encapsulation parameters/Encapsulation: | BGA-256 |
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Dimensions/Length: | 27 mm |
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Dimensions/Width: | 27 mm |
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Dimensions/Height: | 1.53 mm |
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Dimensions/Packaging: | BGA-256 |
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Physical parameters/operating temperature: | 0℃ ~ 70℃ (TA) |
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Other/Product Lifecycle: | Obsolete |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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Customs information/ECCN code: | 3A991.d |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Lattice Semiconductor | 完全替代 | BGA-256 |
IC FPGA 223 I/O 256BGA
|
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