Chip AI consultant
Technical parameters/forward voltage: | 1.2 V |
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Technical parameters/dissipated power: | 0.17 W |
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Technical parameters/rise time: | 100 µs |
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Technical parameters/isolation voltage: | 3750 v |
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Technical parameters/forward current: | 50 mA |
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Technical parameters/breakdown voltage: | 6 V |
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Technical parameters/forward voltage (Max): | 1.4 V |
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Technical parameters/forward current (Max): | 50 mA |
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Technical parameters/descent time: | 20 µs |
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Technical parameters/descent time (Max): | 100 µs |
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Technical parameters/rise time (Max): | 300 µs |
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Technical parameters/operating temperature (Max): | 100 ℃ |
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Technical parameters/operating temperature (Min): | -30 ℃ |
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Technical parameters/dissipated power (Max): | 170 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 4 |
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Encapsulation parameters/Encapsulation: | SOP |
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Dimensions/Packaging: | SOP |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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