Chip AI consultant
Technical parameters/output current: | 60mA @5V |
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Technical parameters/power supply current: | 8.3 mA |
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Technical parameters/number of circuits: | 3 |
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Technical parameters/number of channels: | 3 |
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Technical parameters/Common Mode Rejection Ratio: | 66 dB |
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Technical parameters/input compensation drift: | 7.00 µV/K |
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Technical parameters/bandwidth: | 200 MHz |
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Technical parameters/conversion rate: | 300 V/μs |
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Technical parameters/gain bandwidth product: | 200 MHz |
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Technical parameters/input compensation voltage: | 9 mV |
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Technical parameters/input bias current: | 0.05 nA |
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Technical parameters/available channels: | S, D, T |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/3dB bandwidth: | 450 MHz |
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Technical parameters/Common Mode Rejection Ratio (Min): | 66 dB |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 14 |
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Encapsulation parameters/Encapsulation: | TSSOP-14 |
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Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4.4 mm |
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Dimensions/Height: | 1.15 mm |
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Dimensions/Packaging: | TSSOP-14 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Voltage feedback |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
OPA3355EA/250
|
Burr Brown | 完全替代 | TSSOP |
TEXAS INSTRUMENTS OPA3355EA/250 运算放大器, 三路, 200 MHz, 3个放大器, 360 V/µs, 2.5V 至 5.5V, TSSOP, 14 引脚
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OPA3355EA/250
|
TI | 完全替代 | TSSOP-14 |
TEXAS INSTRUMENTS OPA3355EA/250 运算放大器, 三路, 200 MHz, 3个放大器, 360 V/µs, 2.5V 至 5.5V, TSSOP, 14 引脚
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||
OPA3355UA
|
TI | 完全替代 | SOIC-14 |
OPA 系列，Texas Instruments ### 运算放大器，Texas Instruments
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