Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 256 |
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Encapsulation parameters/Encapsulation: | BGA-256 |
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Dimensions/Packaging: | BGA-256 |
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Physical parameters/operating temperature: | -40℃ ~ 90℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
OMAPL137DZKBD4
|
TI | 功能相似 | BGA-256 |
数字信号处理器和控制器 - DSP, DSC C6000 DSP+ARM Processor 256-BGA
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