Technical parameters/output power: | 1.8 dBm |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/3dB bandwidth: | 3600 MHz |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 6 |
|
Encapsulation parameters/Encapsulation: | TSSOP-363 |
|
Dimensions/Length: | 2.2 mm |
|
Dimensions/Width: | 1.35 mm |
|
Dimensions/Height: | 1 mm |
|
Dimensions/Packaging: | TSSOP-363 |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Philips | 功能相似 |
射频放大器,NXP Semiconductors ### 无线电频率 (RF) 放大器,NXP Semiconductors
|
|||
BGA2711
|
NXP | 功能相似 | TSSOP-363 |
射频放大器,NXP Semiconductors ### 无线电频率 (RF) 放大器,NXP Semiconductors
|
||
RF2320
|
RFMD | 功能相似 |
LINEAR GENERAL PURPOSE AMPLIFIER
|
|||
RF2324
|
RFMD | 功能相似 |
PCS CDMA/TDMA 3V PA DRIVER AMPLIFIER
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review