Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation (metric): | 1608 |
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Encapsulation parameters/Encapsulation: | 0603 |
|
Dimensions/Length: | 1.6 mm |
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Dimensions/Width: | 0.8 mm |
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Dimensions/Packaging (Metric): | 1608 |
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Dimensions/Packaging: | 0603 |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NTHS0603N11N3002JE
|
Vishay Semiconductor | 功能相似 | 0603 |
Thermistor NTC 30KΩ 5% 2Pin 0603 Surface Mount Solder Pad 3715K -4 to -3.5 T/R Automotive
|
||
NTHS0603N11N3002JE
|
VISHAY | 功能相似 | 0603 |
Thermistor NTC 30KΩ 5% 2Pin 0603 Surface Mount Solder Pad 3715K -4 to -3.5 T/R Automotive
|
||
|
|
Vishay Intertechnology | 功能相似 | 0603 |
Thermistor NTC 30KΩ 5% 2Pin 0603 Surface Mount Solder Pad 3715K -4 to -3.5 T/R Automotive
|
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