Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation (metric): | 1005 |
|
Encapsulation parameters/Encapsulation: | 0402 |
|
Dimensions/Length: | 1 mm |
|
Dimensions/Width: | 0.5 mm |
|
Dimensions/Packaging (Metric): | 1005 |
|
Dimensions/Packaging: | 0402 |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NTHS0402N02N1002JE
|
VISHAY | 功能相似 | 0402 |
Thermistor NTC 10KΩ 5% 2Pin 0402 Surface Mount Solder Pad 3486K -4 to -3.5 T/R
|
||
NTHS0402N02N1002JE
|
Vishay Semiconductor | 功能相似 | 0402 |
Thermistor NTC 10KΩ 5% 2Pin 0402 Surface Mount Solder Pad 3486K -4 to -3.5 T/R
|
||
|
|
Vishay Intertechnology | 功能相似 |
Thermistor NTC 10KΩ 5% 2Pin 0402 Surface Mount Solder Pad 3486K -4 to -3.5 T/R
|
|||
NTHS0402N02N1002JR
|
Vishay Dale | 功能相似 | 0402 |
Thermistor NTC 10KΩ 5% 2Pin 0402 T/R
|
||
NTHS0402N02N1002JR
|
Vishay Intertechnology | 功能相似 | 0402 |
Thermistor NTC 10KΩ 5% 2Pin 0402 T/R
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review