Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | CDIP-28 |
|
Dimensions/Packaging: | CDIP-28 |
|
Other/Product Lifecycle: | Unknown |
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Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M27C256B-10F1
|
ST Microelectronics | 功能相似 | CDIP-28 |
STMICROELECTRONICS M27C256B-10F1. 芯片, 存储器, EPROM, CMOS, 256K, DIP28
|
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