Technical parameters/power supply voltage (DC): | 3.30 V, 3.60 V (max) |
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Technical parameters/memory capacity: | 256000000 B |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | 40 ℃ |
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Technical parameters/power supply voltage (Max): | 3.6 V |
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Technical parameters/power supply voltage (Min): | 2.7 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | VFBGA-55 |
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Dimensions/Packaging: | VFBGA-55 |
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Physical parameters/operating temperature: | 40℃ ~ 85℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NAND256W3A2BN6F
|
Micron | 功能相似 | TSOP |
SLC NAND Flash Parallel 3V/3.3V 256Mbit 32M x 8Bit 12us 48Pin TSOP T/R
|
||
|
|
ST Microelectronics | 功能相似 | VFBGA-55 |
SLC NAND Flash Parallel 3V/3.3V 256Mbit 32M x 8Bit 12us 55Pin VFBGA Tray
|
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