Encapsulation parameters/Encapsulation: | SOP-8 |
|
Dimensions/Packaging: | SOP-8 |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W25Q64DWSSIG
|
Winbond Electronics | 功能相似 | SOIC-8 |
64-Mbit(8M x 8bit),SPI接口,工作电压:1.7V to 1.95V
|
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