Technical parameters/number of circuits: | 1 |
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Technical parameters/power supply voltage: | 2V ~ 5V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 4 |
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Encapsulation parameters/Encapsulation: | DSBGA-4 |
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Dimensions/Packaging: | DSBGA-4 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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TI | 功能相似 | VFBGA |
内置增益IC的高灵敏度2线麦克风 Built-in Gain IC’s for High Sensitivity 2-Wire Microphones
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National Semiconductor | 功能相似 | uSMD |
内置增益IC的高灵敏度2线麦克风 Built-in Gain IC’s for High Sensitivity 2-Wire Microphones
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