Technical parameters/number of contacts: | 20 |
|
Technical parameters/polarity: | Male |
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Technical parameters/Contact electroplating: | Gold |
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Technical parameters/number of rows: | 2 |
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Technical parameters/rated current (Max): | 3A/contact |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Encapsulation parameters/installation method: | Through Hole |
|
Dimensions/Height: | 8.63 mm |
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Physical parameters/shell color: | Black |
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Physical parameters/contact material: | Phosphor Bronze |
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Physical parameters/operating temperature: | -55℃ ~ 125℃ |
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Other/Packaging Methods: | Bulk |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
68602-120HLF
|
Future Communications IC | 类似代替 |
AMPHENOL FCI 68602-120HLF Board-To-Board Connector, 2.54mm, 20Contacts, Header, BergStik 68602 Series, Through Hole, 2Rows
|
|||
77313-101-20LF
|
Amphenol | 类似代替 | throughHole |
AMPHENOL FCI 77313-101-20LF 板至板连接, 垂直, BergStik 77313系列, 20 触点, 针座, 2.54 mm, 焊接, 2 排
|
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