Chip AI consultant
Encapsulation parameters/installation method: | Through Hole |
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Other/Factory Pack Quantity: | 100 |
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Other/Terminal Seals: | Sealed |
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Other/Series: | Green |
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Other/Contact Forms: | SP3T |
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Other/Switch Functions: | ON - OFF - ON |
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Other/Determination Styles: | Solder Lug |
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Other/Pushing Size: | 1/4-40 |
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Other/Matching Styles: | Through Hole |
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Other/Contact Plating: | Gold Flash over Silver |
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Other/Creators: | Bat |
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Other/Part # Aliases: | 1-1571920-8 |
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Other/RoHS: | Compliant |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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