Chip AI consultant
Technical parameters/frequency: | 1 MHz |
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Technical parameters/number of output interfaces: | 1 |
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Technical parameters/Input voltage (DC): | 60.0 V |
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Technical parameters/output voltage: | 250 mV |
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Technical parameters/output current: | 100 mA |
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Technical parameters/power supply current: | 1 mA |
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Technical parameters/number of channels: | 1 |
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Technical parameters/number of pins: | 16 |
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Technical parameters/output power: | 13.0 W |
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Technical parameters/duty cycle: | 80 % |
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Technical parameters/Input voltage (Max): | 60 V |
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Technical parameters/input voltage (Min): | 1.8 V |
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Technical parameters/output power (Max): | 13 W |
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Technical parameters/rated power (Max): | 12.95 W |
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Technical parameters/maximum duty cycle: | 80 % |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 1.8V ~ 60V |
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Technical parameters/input voltage: | 60 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | TSSOP-16 |
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Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4.4 mm |
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Dimensions/Height: | 0.9 mm |
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Dimensions/Packaging: | TSSOP-16 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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Other/Manufacturing Applications: | Power Management, Communication and Networking Alternative material
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