Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 86 |
|
Encapsulation parameters/Encapsulation: | TSOP-2 |
|
Dimensions/Packaging: | TSOP-2 |
|
Physical parameters/operating temperature: | -40℃ ~ 105℃ |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Elpida | 功能相似 | TSOP-2 |
Synchronous DRAM, 4MX32, 6ns, CMOS, PDSO86, PLASTIC, TSOP2-86
|
||
ALE
|
Central Semiconductor | 功能相似 |
Synchronous DRAM, 4MX32, 6ns, CMOS, PDSO86, PLASTIC, TSOP2-86
|
|||
MT48LC4M32B2P-6AIT:L
|
Micron | 功能相似 | TSOP-2 |
DRAM Chip SDRAM 128Mbit 4Mx32 3.3V Automotive 86Pin TSOP-II
|
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