Technical parameters/power supply voltage (DC): | 1.80 V, 1.90 V (max) |
|
Technical parameters/clock frequency: | 533MHz (max) |
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Technical parameters/access time: | 3.75 ns |
|
Technical parameters/memory capacity: | 256000000 B |
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Technical parameters/power supply voltage: | 1.7V ~ 1.9V |
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Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | FBGA-60 |
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Dimensions/Packaging: | FBGA-60 |
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Physical parameters/operating temperature: | 0℃ ~ 85℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray, Bulk |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MT47H32M8BP-37E
|
Micron | 类似代替 | FBGA |
DRAM Chip DDR2 SDRAM 256M-Bit 32Mx8 1.8V 60Pin FBGA Tray
|
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