Technical parameters/operating voltage: | 2.50 V |
|
Technical parameters/power supply current: | 230 mA |
|
Technical parameters/digits: | 8 |
|
Technical parameters/access time: | 700 ps |
|
Technical parameters/access time (Max): | 0.7 ns |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 2.5V ~ 2.7V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 60 |
|
Encapsulation parameters/Encapsulation: | FBGA-60 |
|
Dimensions/Height: | 0.8 mm |
|
Dimensions/Packaging: | FBGA-60 |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | PB free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MT46V64M8BN-6 IT:F
|
Micron | 类似代替 | FBGA-60 |
DRAM Chip DDR SDRAM 512Mbit 64Mx8 2.5V 60Pin FBGA Tray
|
||
MT46V64M8BN-6 IT:F TR
|
Micron | 功能相似 | TFBGA-60 |
DRAM Chip DDR SDRAM 512Mbit 64Mx8 2.5V 60Pin FBGA T/R
|
||
MT46V64M8CV-5B IT:J
|
Alliance Memory | 完全替代 | TFBGA-60 |
DRAM Chip DDR SDRAM 512Mbit 64Mx8 2.6V 60Pin FBGA
|
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