Chip AI consultant
Package parameters/number of pins: | 48 |
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Encapsulation parameters/Encapsulation: | TSOP |
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Dimensions/Packaging: | TSOP |
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Physical parameters/operating temperature: | -40℃ ~ 105℃ |
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Other/Boot Blocks: | No |
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Other/Supplier Packages: | TSOP-I |
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Other/Programming Voltage: | 2.7, 3.6 V |
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Other/Cell Type: | SLC NAND |
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Other/Maximum Operating Supply Voltage: | 3.6 V |
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Other/Pin Count: | 48 |
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Other/Product Dimensions: | 18.4 x 12 x 1(Max) mm |
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Other/Creating Levels: | Automotive |
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Other/Maximum Operating Current: | 35 mA |
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Other/Minimum Operating Supply Voltage: | 2.7 V |
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Other/Number of Words: | 512 MWords |
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Other/Program Current: | 20 mA |
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Other/Counting: | Surface Mount |
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Other/Address Bus Width: | 30 Bit |
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Other/Block Organization: | Symmetrical |
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Other/Operating Temperature: | -40 to 105 °C |
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Other/Lead Finish: | Matte Tin |
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Other/Max Processing Temps: | 260 °C |
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Other/Architecture: | Sectored |
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Other/Number of Bits per Word: | 8 Bit |
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Other/Sensitivity: | 4 Gb |
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Other/Typical Operating Supply Voltage: | 3.3000 V |
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Other/Timing Types: | Asynchronous |
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Other/Interface Types: | Parallel |
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Other/Maximum Erase Time: | 0.01/Block s |
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Other/Maximum Programming Time: | 0.6/Page ms |
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Other/Drag Suspend/Resume Modes Support: | No |
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Other/Simulineos Read/Write Support: | No |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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