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Model MSP430G2413IPW20

Description MSP430G2x Ultra low power microcontroller, Texas Instruments * * MSP430G2xx - Value Line Series * * features a 16MHz CPU that provides ultra-low power performance while offering low-cost options for your design. Up to 16MHz CPU speed of 1.8 to 3.6V, operating up to 56KB flash memory and up to 4KB RAM, a wide range of high-performance peripheral devices. Some circuits have unique capacitive touch sensing IO ports, 0.1 μ A RAM retention, 0.4 μ A standby mode, 220 μ A/MHz active standby mode, ultra fast wake-up speed, less time than # # # MSP430 microcontrollers. Texas Instruments * * MSP430 platform * * is a mixed signal and ultra-low power microcontroller series from Texas Instruments. The 16 bit RISC architecture is particularly suitable for wireless, low-power industrial, and portable applications. This establishment scope has a sturdy and commonly used location due to its ease of use and a wide range of development tools and support packages. The MSP430 portfolio includes over 400 devices, ranging from MSP430 value models to innovative, highly integrated microcontrollers with embedded FRAM memory. This wide range of products offers integration suitable for various designs and applications. High performance peripherals include USB, RF, LCD controllers, and Sigma Delta ADCs. This enables designers to find suitable MSP430 devices for various low-power applications.

Brand: TI

Packaging TSSOP-20

Delivery time

Packaging method Tube

Standard packaging quantity 1

Freight charges： In stock Freight rate：$13.00

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Inventory(8647) Minimum order quantity(1)

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Technical parameters/frequency:	16 MHz
Technical parameters/clock frequency:	16.0 MHz
Technical parameters/RAM size:	512 B
Technical parameters/FLASH memory capacity:	8192 B
Technical parameters/number of ART:	1
Technical parameters/Analog to Digital Conversion (ADC):	1
Technical parameters/RAM memory capacity:	0 B
Technical parameters/operating temperature (Max):	85 ℃
Technical parameters/operating temperature (Min):	-40 ℃
Encapsulation parameters/installation method:	Surface Mount
Package parameters/number of pins:	20
Encapsulation parameters/Encapsulation:	TSSOP-20
Dimensions/Length:	6.6 mm
Dimensions/Width:	4.5 mm
Dimensions/Height:	1.05 mm
Dimensions/Packaging:	TSSOP-20
Physical parameters/operating temperature:	-40℃ ~ 85℃ (TA)
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Tube
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free