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Model MSP1B22R00JR10E3
Description MSP 1W Series molded packaging ensures mechanical and climate protection as well as high dielectric insulation. Metal film or wire wound structure Dimensions (mm) --- A | B | C | D | E | F | W | X | Z 6,9 | 3,9 | 3,8 | 2,5 | 6,5 | 1,4 | 2,7 | 2,9 | 6 Power at 70 ° C | 1W --------- Resistance Tolerance | ± 5% Temperature Coefficient | | | 10 Ω=± 25ppm/° C Operating Temperature | -55 → 200 ° C Operating Voltage | 50V (Max.) # # # Surface Installation - Molding Power
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Brand: Vishay Semiconductor
Packaging Surface Mount
Delivery time
Packaging method
Standard packaging quantity 1
18.28  yuan 18.28yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(1844) Minimum order quantity(1)
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Technical parameters/tolerances:

±5 %

 

Technical parameters/rated power:

1 W

 

Technical parameters/resistance:

2.2 kΩ

 

Technical parameters/operating temperature (Max):

275 ℃

 

Technical parameters/operating temperature (Min):

-55 ℃

 

Encapsulation parameters/installation method:

Surface Mount

 

Dimensions/Length:

6.9 mm

 

Dimensions/Height:

3.8 mm

 

Physical parameters/operating temperature:

-55℃ ~ 275℃

 

Physical parameters/temperature coefficient:

±25 ppm/℃

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

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