Technical parameters/number of circuits: | 1 |
|
Technical parameters/power supply voltage: | 3V ~ 3.6V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | TSSOP-8 |
|
Dimensions/Length: | 3.10 mm |
|
Dimensions/Width: | 4.40 mm |
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Dimensions/Packaging: | TSSOP-8 |
|
Dimensions/Thickness: | 1.00 mm |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2305-1DCG
|
Integrated Device Technology | 完全替代 | SOIC-8 |
3.3V零延迟时钟缓冲器无需外部RC网络 3.3V ZERO DELAY CLOCK BUFFER No external RC network required
|
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