Encapsulation parameters/Encapsulation: | CASE 318-07 |
|
Dimensions/Packaging: | CASE 318-07 |
|
Other/Product Lifecycle: | Unknown |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PMBFJ177@215
|
NXP | 类似代替 | SOT-23-3 |
PMBFJ177@215
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review