Technical parameters/power supply voltage (DC): | 1.20 V |
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Technical parameters/number of logic gates: | 250000 |
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Technical parameters/I/O pin count: | 158 |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | 0 ℃ |
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Technical parameters/power supply voltage: | 1.14V ~ 1.26V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 208 |
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Encapsulation parameters/Encapsulation: | BFQFP-208 |
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Dimensions/Length: | 28 mm |
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Dimensions/Width: | 28 mm |
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Dimensions/Height: | 3.4 mm |
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Dimensions/Packaging: | BFQFP-208 |
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Physical parameters/operating temperature: | 0℃ ~ 85℃ (TJ) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Customs Information/Hong Kong Import and Export License: | NLR |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC3S250E-4PQ208I
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Xilinx | 完全替代 | BFQFP-208 |
FPGA Spartan®-3E Family 250K Gates 5508 Cells 572MHz 90nm (CMOS) Technology 1.2V 208Pin PQFP
|
||
XC3S250E-4PQG208C
|
Xilinx | 完全替代 | BFQFP-208 |
Xilinx ### 现场可编程门阵列 (FPGA) FPGA 是一种半导体设备,包含通过可编程互连连接的可配置逻辑块 (CLB) 矩阵。 用户通过编程 SRAM 确定这些互连。 CLB 可以简单(与或门等),也可以复杂(RAM 块)。 FPGA 允许对设计进行更改,即使在设备焊接到印刷电路板上之后。
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