Technical parameters/power supply voltage: | 1.14V ~ 1.26V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 676 |
|
Encapsulation parameters/Encapsulation: | FBGA-676 |
|
Dimensions/Packaging: | FBGA-676 |
|
Physical parameters/operating temperature: | -40℃ ~ 100℃ (TJ) |
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Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC3S1000-4FG676C
|
Xilinx | 完全替代 | FBGA-676 |
XC3S1000 4FG676C 磨码
|
||
XC3S1000-4FG676I
|
Xilinx | 完全替代 | FBGA-676 |
XC3S1000 4FG676I 磨码
|
||
XC3S1000-5FG676C
|
Xilinx | 完全替代 | FBGA-676 |
XC3S1000 5FG676C 磨码
|
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