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Model XC3S700A-4FGG484C
Description XC3S700A 4FGG484C Grinding code
Product QR code
Brand: Xilinx
Packaging BBGA-484
Delivery time
Packaging method Each
Standard packaging quantity 1
1.26  yuan 1.26yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(4917) Minimum order quantity(1)
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Technical parameters/frequency:

250 MHz

 

Technical parameters/RAM size:

46080 B

 

Technical parameters/number of logic gates:

700000

 

Technical parameters/power supply voltage:

1.14V ~ 1.26V

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

484

 

Encapsulation parameters/Encapsulation:

BBGA-484

 

Dimensions/Packaging:

BBGA-484

 

Physical parameters/operating temperature:

0℃ ~ 85℃

 

Other/Product Lifecycle:

Active

 

Other/Packaging Methods:

Each

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with standards/lead standards:

Lead Free

 

Compliant with the REACH SVHC standard:

No SVHC

 

Customs information/ECCN code:

ECL99

 

Customs Information/Hong Kong Import and Export License:

NLR

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
XC3S1000-4FGG456I XC3S1000-4FGG456I Xilinx 类似代替 FBGA-456
XC3S1000-4FGG456I 磨码
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