Technical parameters/power supply voltage (DC): | 3.00 V |
|
Technical parameters/number of logic gates: | 400000 |
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Technical parameters/I/O pin count: | 264 |
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Technical parameters/power supply voltage: | 1.14V ~ 1.26V |
|
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 456 |
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Encapsulation parameters/Encapsulation: | FBGA-456 |
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Dimensions/Packaging: | FBGA-456 |
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Physical parameters/operating temperature: | 0℃ ~ 85℃ (TJ) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Bulk |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Customs Information/Hong Kong Import and Export License: | NLR |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XA3S400-4FGG456I
|
Xilinx | 完全替代 | BBGA-456 |
XA3S400 4FGG456I 磨码
|
||
XC3S400-4FGG456I
|
Xilinx | 完全替代 | FBGA-456 |
XC3S400 4FGG456I 磨码
|
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