Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | TSSOP-8 |
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Dimensions/Packaging: | TSSOP-8 |
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Other/Case/Package: | 8-TSSOP, 8-MSOP(0.118", 3.00mm 폭) |
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Other: | 포지티브 고정 |
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Other/류 - Delete 한: | 60mA |
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Other/실동형: | 표면실장(SMD, SMT) |
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Other: | 5V |
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Other/Upgrades: | 2V @ 50mA |
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Other/류 - 출력: | 50mA |
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Other/작동온도: | -40°C ~ 125°C |
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Other: | 6 V ~ 120 V |
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Other: | 1 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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