Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | MSOP |
|
Dimensions/Packaging: | MSOP |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Micrel | 完全替代 | MSOP |
IC REG LDO 3.8V 50mA 8MSOP
|
||
MIC5208-3.8BMM
|
Microchip | 完全替代 | TSSOP-8 |
IC REG LDO 3.8V 50mA 8MSOP
|
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