Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | SOIC-20 |
|
Dimensions/Packaging: | SOIC-20 |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MIC2177-3.3YWM-TR
|
Microchip | 完全替代 | SOIC-20 |
MIC2177 系列 2.5 A 200 kHz 20引线 SOIC 同步 步降 (降压) 稳压器
|
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