Technical parameters/Contact electroplating: | Gold |
|
Technical parameters/Insulation resistance: | 1000 MΩ |
|
Technical parameters/Contact resistance: | 5.00 mΩ |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | -65 ℃ |
|
Encapsulation parameters/installation method: | Through Hole |
|
Dimensions/Height: | 6.5 mm |
|
Physical parameters/contact material: | Beryllium Copper |
|
Physical parameters/insulation material: | Teflon |
|
Physical parameters/operating temperature: | -65℃ ~ 125℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tray |
|
Other/Manufacturing Applications: | Industrial, Industrial |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
Compliant with standard/REACH SVHC version: | 2015/06/15 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
BEL Fuse | 功能相似 |
射频/同轴, MCX 母, 直型, 75Ω, 焊接
|
|||
133-8701-201
|
Emerson Network Power | 功能相似 |
射频/同轴, MCX 母, 直型, 75Ω, 焊接
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review