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Description MCP212x IrDA The MCP2120/22 development board is used for easy demonstration and development of IrDA applications. The board can be powered through USB or power test points (VDD and GND). Pre program PIC18F65J50 firmware to generate MCP2122 clock. The host interface can be connected to UART driver devices (for IrDA to UART operation), and can communicate through DB-9 connectors or connect to PIC18F65J50 for independent operation. All USB interface signals are connected to PIC18F65J50, allowing programs to be created in applications where PIC18F65J50 communicates with USB and MCP2122, making the board usable as an IrDA to USB converter. Micro USB connector (used to power the board) onboard+3.3V regulator, used to power the PIC18F65J50 hook, for external adjustment of DC power jumper, used to isolate PIC18F65J50 power signal from the board power supply. This allows the board to operate the RS-232 connector and associated hardware at voltages above+3.3V, for direct connection to MCP2120 or MCP2122 UART twelve pin sockets, for connecting the host UART interface four jumpers (3 pins), for selecting the UART signal source. The DB-9 connector or PIC18F65J50 external clock (from ECCP1 pin of PIC18F65J50) jumper has a green power on LED indicator. Implemented infrared transceiver circuit (two optional optical transceiver circuits have been implemented but not assembled) reset switch for PIC18F65J50 device. ICSP ™ Tube socket, used for programming PIC18F65J50 jumper options, used for PIC18F65J50 program selection (not installed) jumper, used for selecting MCP2120/22 reset signal source jumper, used for selecting MCP2120 mode signal source MCP2120/22 SOIC and DIP imprint (DIP package is installed by default) # # # Transceiver
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Packaging Board
Delivery time
Packaging method
Standard packaging quantity 1
273.23  yuan 273.23yuan
  • Freight charges   In stock Freight rate:$13.00
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Technical parameters/digits:

8

 

Technical parameters/kernel architecture:

PIC

 

Technical parameters/internal nuclear architecture:

PIC18

 

Encapsulation parameters/Encapsulation:

Board

 

Dimensions/Packaging:

Board

 

Other/Product Lifecycle:

Unknown

 

Other/Manufacturing Applications:

Communications & Networking, Wireless, Embedded Design & Development

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with standards/lead standards:

Lead Free

 

Compliant with the REACH SVHC standard:

No SVHC

 

Compliant with standard/REACH SVHC version:

2015/12/17

 

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